2-layer CuClad 233 PCB 20mil Thick with Immersion Gold Finish
This 2-layer rigid PCB, constructed with Rogers CuClad 233 as its base material, is engineered to meet the demands of high-frequency and precision electronic systems. With board dimensions of 108mm x 59mm (1 piece) and a tight tolerance of +/- 0.15mm, it offers a reliable foundation for applications requiring consistent performance in challenging environments.
PCB Details
| Construction Detail |
Specification |
| Base material |
CuClad 233 |
| Layer count |
2-layer |
| Board dimensions |
108 mm x 59 mm (1 piece), +/- 0.15mm |
| Minimum Trace/Space |
6/8 mils |
| Minimum Hole Size |
0.3mm |
| Blind vias |
No |
| Finished board thickness |
0.6mm |
| Finished Cu weight |
Outer layers: 1 oz (1.4 mils) |
| Via plating thickness |
20 μm |
| Surface finish |
Immersion Gold |
| Silkscreen |
No |
| Solder Mask |
No |
| Quality assurance (prior to shipment) |
100% Electrical test |
PCB Stack-up
The 2-layer rigid PCB features a precisely calibrated stack-up to leverage CuClad 233's unique properties:
| Layer/Material |
Thickness Specification |
| Copper_layer_1 |
35 μm |
| Rogers CuClad 233 Core |
0.508mm (20mil) |
| Copper_layer_2 |
35 μm |
Artwork, Standards, and Availability
Artwork Format: Gerber RS-274-X, a universal standard for PCB manufacturing data, ensuring seamless production.
Quality Standard: Complies with IPC-Class-2, guaranteeing reliable performance for general electronic applications.
Availability: Offered worldwide, making it accessible for global projects across industries.
Key Features of Rogers CuClad 233
- Electrical Stability: Dielectric Constant (Dk) of 2.33 at 10GHz and 1MHz, with a low dissipation factor of 0.0013 at 10GHz, minimizing signal loss in high-frequency applications.
- Mechanical and Environmental Resilience: Low moisture absorption (0.02%) and strong peel strength (14 lbs/in) ensure durability in harsh conditions.
- Outgassing Control: Ultra-low Total Mass Loss (TML) of 0.01%, Collected Volatile Condensable Material (CVCM) of 0.01%, and zero Water Vapor Regain (WVR), making it suitable for aerospace and high-reliability environments.
- Uniformity: Better dielectric constant uniformity compared to non-woven fiberglass reinforced laminates, ensuring consistent performance across the board.
- Material Balance: High PTFE to glass ratio, enhancing electrical performance while maintaining structural rigidity.
Benefits of CuClad 233
- Stable Dk Over Frequency: Ensures consistent signal propagation across a wide range of operating frequencies.
- Reduced Insertion Loss: Low Dk supports wider line widths, minimizing signal attenuation in high-frequency circuits.
- Low Circuit Losses: Enhances overall efficiency, particularly in microwave and radar systems.
- Scalability: Supports large PCB and antenna formats, making it suitable for applications requiring extended layouts.
- Compatibility: In-plane CTE (Coefficient of Thermal Expansion) matches aluminum used in aircraft skins/structures, reducing thermal stress in aerospace applications.
Typical Applications
- Radars
- Electronic Countermeasures and Electronic Support Measures
- Microwave Components (LNAs, filters, couplers, etc.)
For inquiries regarding pricing, you can send gerber file to us. We serve clients worldwide and ensure prompt responses to all queries.
