This PCB is a 10-layer mixed-dielectric multilayer circuit board adopting composite stacking of RO4003C ceramic hydrocarbon laminate and RF4-370HR high-Tg FR4 material. It features asymmetric mixed copper foils with 1oz outer copper and 1oz/0.5oz inner copper, with a finished lamination thickness of 1.618mm. Fitted with double-sided blue solder mask and white silkscreen, the board applies enhanced immersion gold treatment (135%-150% gold thickness). Equipped with precise controlled impedance circuit, multiple groups of blind vias and professional resin plugging holes, this high-frequency hybrid PCB delivers stable signal transmission and excellent thermal reliability, perfectly suitable for RF microwave communication, broadband wireless equipment and high-precision impedance matching systems.
PCB Construction Details
| Construction Item | Details |
| Base Material | 4 pieces of 8mil RO4003C + RF4-370HR hybrid dielectric, combining low-loss high-frequency performance and high thermal stability |
| Layer Count | 10 layers – Custom hybrid RF PCB for controlled impedance microwave circuits |
| Board Dimensions | 132mm × 144mm (1PCS), customized dimension for high-frequency module assembly |
| Finished Pressing Thickness | 1.618mm precise lamination thickness, maintaining stable structural flatness for impedance control |
| Copper Weight | Outer layer: 1oz finished copper; Inner layer: 1oz / 0.5oz asymmetric mixed copper for differentiated circuit routing |
| Surface Finish | Enhanced Immersion Gold (135%-150% gold thickness), thicker gold layer for superior conductivity and oxidation resistance |
| Silkscreen & Solder Mask | Top & Bottom: Blue Solder Mask with White Silkscreen, beautiful appearance and reliable insulation protection |
| Special Impedance Control | Top layer: 12.2mil trace width for 50Ohm impedance; Layer 3: 3.5mil width / 5.5mil spacing for 80Ohm impedance |
| Advanced Structure Technology | Blind Vias: L1-L2, L9-L10, L7-L10; All vias processed with professional resin plugging technology for insulation and stability |
| Quality Testing | 100% impedance testing, continuity inspection and resin plugging void detection to meet high-frequency industrial standards |
Artwork Format & Compliance Standard
Artwork Format: Supplied in Gerber RS-274-X, universal industrial standard for multilayer hybrid PCB precision manufacturing.
Quality Standard: Compliant with IPC-Class-2 criteria, ensuring stable impedance performance for long-term RF signal transmission.
Availability: Global shipping service to support international wireless communication and RF engineering procurement.
Introduction of Rogers RO4003C
RO4003C belongs to the premium RO4000 hydrocarbon ceramic laminate series, specially engineered for superior high-frequency performance and cost-effective circuit fabrication. As a low-loss dielectric material, it is fully compatible with standard FR-4 manufacturing processes, breaking the cost limitation of traditional high-frequency boards. This substrate is perfectly tailored for RF microwave circuits, impedance-controlled transmission lines and signal matching networks, maintaining excellent electrical performance under high-frequency working conditions above 500MHz.
RO4003C features an extremely low temperature coefficient of dielectric constant and stable Dk value across a wide frequency range, effectively reducing signal insertion loss. Adopting LoPro copper foil option further optimizes high-frequency transmission efficiency. Its copper-matched CTE provides outstanding dimensional stability, which is highly suitable for mixed-dielectric multilayer stacking structures. With a Tg higher than 280°C, it retains stable expansion characteristics during high-temperature processing. Unlike PTFE materials, RO4003C requires no complicated sodium etching treatment for vias, realizing automated production and improving fabrication efficiency.
Typical Applications for RO4003C
As a low-loss hydrocarbon ceramic laminate, RO4003C is specially designed for high-frequency microwave scenarios requiring ultra-stable signal performance. It is widely adopted in commercial RF communication and precision microwave devices:
Cellular base station antennas, power amplifiers and RF transceiver modules
Automotive millimeter-wave radar, ADAS sensing and collision avoidance systems
Satellite communication equipment, including LNB downconverters and satellite receiving terminals
Microwave point-to-point communication and broadband wireless transmission devices
High-precision RF filters, low-noise amplifiers and impedance matching networks
RFID radio frequency identification tags and industrial microwave sensing equipment
Introdtuction of RF4-370HR
RF4-370HR is a high-performance high-Tg FR4 substrate with a glass transition temperature of 180°C. Manufactured with multifunctional high-performance epoxy resin and E-glass fabric, this material possesses lower thermal expansion rate and better thermal stability than conventional FR4 while retaining excellent FR4 processability. It has a thermal decomposition temperature (Td) of 340°C, with T260 durability reaching 60 minutes and T288 reaching 30 minutes, providing extreme thermal cycling resistance for multilayer PCBs.
UV-blocking and AOI fluorescence characteristics ensure high compatibility with automated optical inspection systems, improving production accuracy and efficiency. With excellent CAF resistance, superior chemical stability and moisture resistance, 370HR is widely used in sequential lamination multilayer boards. It supports diversified copper foil, glass fabric and prepreg specifications, fully compliant with RoHS environmental standards and certified by IPC and UL authoritative certifications.
Typical Applications for 370HR
As a high-Tg reliable FR-4 substrate, 370HR focuses on high-temperature resistance, CAF resistance and complex multi-sequential lamination boards, ideal for harsh industrial and high-reliability electronic products:
Server mainboards, communication power supplies and telecom infrastructure backplanes
Industrial control equipment requiring long-term continuous operation and thermal cycling resistance
Automotive on-board electronic modules and harsh environment vehicle control circuits
Multi-layer complex PCBs with sequential lamination and high-density interconnection
Precision detection instruments requiring AOI automated optical inspection
Energy storage equipment and industrial power management circuit boards
